Deep Clustering based Boundary-Decoder Net for Inter and Intra Layer Stress Prediction of Heterogeneous Integrated IC Chip

Predicting stress fields in hyperelastic materials with complex microstructures remains challenging for traditional deep learning surrogates, which struggle to capture both sharp stress concentrations and the wide dynamic range of stress magnitudes. Convolutional architectures such as UNet tend to oversmooth high-frequency gradients, while neural operators like DeepONet exhibit spectral bias and underpredict localized extremes. Diffusion models can recover fine-scale structure but often introduce low-frequency amplitude drift, degrading physical scaling. To address these limitations, we propose a hybrid surrogate framework, cDDPM-DeepONet, that decouples stress morphology from magnitude. A conditional denoising diffusion probabilistic model (cDDPM), built on a UNet backbone, generates normalized von Mises stress fields conditioned on geometry and loading. In parallel, a modified DeepONet predicts global scaling parameters (minimum and maximum stress), enabling reconstruction of full-resolution physical stress maps. This separation allows the diffusion model to focus on spatial structure while the operator network corrects global amplitude, mitigating spectral and scaling biases. We evaluate the framework on nonlinear hyperelastic datasets with single and multiple polygonal voids. The proposed model consistently outperforms UNet, DeepONet, and standalone cDDPM baselines by one to two orders of magnitude. Spectral analysis shows strong agreement with finite element solutions across all wavenumbers, preserving both global behavior and localized stress concentrations.

Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package FEM simulation can take hours, while AI-based surrogates treat the entire stack as a monolithic prediction target and must be retrained whenever the die count or topology changes. To address this limitation, this work proposes Domain-Decomposed AI-Accelerated Iterative Solver for Thermal Analysis (DAIST), a composable thermal solver that decomposes the global package simulation into block-level subdomain problems, replaces subdomain solvers with neural operators, and couples them through iterative exchanges of interfacial temperature and heat flux. This local-to-global architecture eliminates the topology lock-in of monolithic models: block-level neural operators can be directly reused in unseen package assemblies without retraining. The iterative coupling strategy further provides a controllable accuracy-runtime tradeoff, where the iteration budget can be adjusted to trade accuracy for runtime. Evaluated on a multi-chiplet system and an advanced packaging system, DAIST achieves up to $178\times$ speedup over traditional FEM solvers with mean temperature errors of 0.068% and 0.323%, respectively, while demonstrating cross-topology reuse of block-level models across structurally distinct package assemblies.

Accurate prediction of stress and strain fields in hierarchical composite microstructures is critical for physics-informed material design, yet conventional finite element method (FEM) simulations are computationally prohibitive at scale, requiring minutes to days per evaluation. In this work, we propose a hybrid UNet-Transformer architecture that predicts complex mechanical field distributions directly from composite microstructure geometry images, serving as an efficient surrogate for FEM across ten distinct stress and strain field types spanning diverse two-phase composite configurations including square, hexagonal, and triangular tessellations, multiple boundary conditions, and high-resolution geometries. Results demonstrate that the proposed architecture achieves strong predictive performance across the majority of subdatasets, with peak accuracy on periodic tessellation geometries reaching R2=0.9991, SSIM=0.9936, and MAE=0.0050 on the boundary condition subdataset and the triangular tessellation subdataset respectively. Across six of the eight evaluated subdatasets, MAE remains below 0.05 on the normalized [0,1] pixel scale. Encoder attention analysis via Grad-CAM and Grad-CAM++ confirms that the model develops physically meaningful internal representations, localizing attention at mechanically critical regions including phase boundaries, ligament junctions, and indenter contact zones without explicit structural supervision. Performance degrades on irregular square-grid geometries with sparse soft-phase inclusions, with the S11 normal stress subdataset yielding R2=0.7735 and SSIM=0.7126, consistent with the known limitation of smooth-loss image translation models in reproducing sharp stress discontinuities.