Signal integrity (SI) analysis in printed circuit board (PCB) interconnects faces increasing complexity due to diverse integrated circuit (IC) buffer technologies, varying operating conditions, and manufacturing tolerances. Existing machine learning (ML) surrogate models for predicting SI metrics such as the inner eye contour, eye-height (EH), eye-width (EW), and transient waveform features typically rely on fixed buffer parameters, requiring costly new data generation and retraining cycles for every technology shift. This paper introduces a buffer-parameterized ML surrogate modeling methodology capable of handling cross-technology variations without retraining by treating IC buffer characteristics, e.g., clock frequency, supply voltage, rise/fall times, jitter, and internal resistors and capacitors, as dynamic model inputs alongside PCB parameters. To identify the optimal surrogate architecture for this high-dimensional space, a comprehensive benchmarking study compares tree-based methods (RFR/GBM), kernel methods (SVR/KRR), Gaussian process regression (GPR), and neural networks. The framework is subsequently validated on a complex interconnect with 44 design parameters. Results show that while anisotropic GPR excels in low-data regimes, neural networks heavily outperform other models on large datasets. Finally, the practical value of the ML surrogate models is demonstrated through a cross-technology design space exploration and optimization scenario, showcasing massive computational speedups for eye mask compliance checking compared to simulation.
Pre-layout design space exploration (DSE) for high-speed signal integrity (SI) analysis is often limited by the computational cost of simulations and iterative optimization algorithms within modern electronic design automation (EDA) workflows. While machine learning surrogate models accelerate the simulation step, optimizing designs still requires utilizing iterative black-box search methods. This iterative nature scales poorly, making multi-corner sweeps computationally expensive. As a solution, this paper proposes amortized neural optimization (ANO) for pre-layout SI design. ANO entirely eliminates iterative black-box inference by utilizing fully differentiable neural network surrogate models. ANO extracts analytical gradients from the surrogate to train a global optimization policy. Instead of solving the optimization problem repeatedly at inference, the optimization process is learned offline and therefore amortized. Once the ANO policy is trained, it maps different channel contexts directly to near-optimal design parameters in a single deterministic forward pass. The efficiency and accuracy of the ANO framework are demonstrated based on three complex SI design scenarios, including DDR5 decision feedback equalization (DFE), 9-dimensional SerDes Tx/Rx co-equalization, and DDR3 DQS differential pair routing to optimize eye diagram metrics under intra-pair skew constraints. By trading roughly 10% in optimality compared to instance-specific black-box algorithms, it realizes speedups of three to four orders of magnitude. For a large-scale 320,000-instance multi-corner SerDes sweep optimization, ANO collapses what would have taken days of computation using iterative search algorithms into a single batched forward pass that completes in milliseconds. This transforms computationally expensive SI optimization into real-time and interactive pre-layout DSE.
This work presents a deterministic, machine-assisted framework for SI-compliant PCB design based on the Earth Mover's Distance (EMD). In contrast to conventional surrogate-based optimization methods that rely on iterative black-box search procedures, the proposed approach follows an interpretable, sequential evaluation strategy. Neural surrogate models are first used to efficiently predict waveform describing features from topology-dependent design parameters. A decision tree then acts as a physically motivated quality gate that identifies SI-compliant waveforms according to predefined SI criteria. Within the resulting valid solution space, the Earth Mover's Distance is employed as a similarity metric to rank candidate designs according to their proximity to an ideal reference signal. This enables not only the deterministic identification of admissible parameter regions but also a transparent prioritization of physically superior solutions without inverse modeling or stochastic search procedures. The methodology is demonstrated using a large-scale set of simulated DDR3 fly-by waveforms. By combining surrogate prediction, interpretable classification, and EMD-based waveform evaluation, the framework provides an explainable and computationally efficient alternative to conventional optimization strategies for supporting PCB development with AI-based methods.
Accurately predicting the performance of active radio frequency (RF) circuits is essential for modern wireless systems but remains challenging due to highly nonlinear behavior and the high computational cost of traditional simulation tools. Existing machine learning (ML) surrogates often require large datasets to generalize across various topologies or are not accurate on held-out circuits. This work presents a lightweight, data-efficient, and topology-aware graph neural network (GNN) framework for predicting key performance metrics of active RF circuit classes, such as low-noise amplifiers (LNAs), mixers, voltage-controlled oscillators (VCOs), power amplifiers (PAs), and voltage amplifiers (VAs). The proposed framework employs RFIC domain-informed feature indexing to enable cross-topology adaptability by cheap encoding of functional device semantics (e.g., differential pair and varactor transistors) and efficient knowledge transfer. The surrogate model represents circuits using device-terminal graph abstractions to preserve fine-grained connectivity and transistor-level symmetry. The final model is generalized to a wide variety of classes by being trained in parallel. Experimental results demonstrate accurate modeling of multimodal and heavy-tailed RF performance distributions, achieving an average mean relative error (MRE) of 2.71% across nineteen topologies, an improvement of 3.3x and 20x faster in training over prior art, and the generalization to held-out topologies is improved by ~26.2x. Furthermore, this work shows ~36x training data efficiency compared to state-of-the-art, demonstrating its effectiveness for scalable and deployment-ready RF design automation.
Anahita Asadi, Leonid Popryho, Inna Partin-Vaisband