Organizations: 1HYU-KITECH Joint Department, Hanyang University, Ansan, 15588, Korea · 4Korea Institute of Industrial Technology, Ansan, 15588, Korea · 2Micro/Nano System Department, Korea University, Seoul 02841, Korea · Department of Photonics and Nanoelectronics, Hanyang University, Ansan, 15588, Korea
Abstract
Semiconductor lithography inspection requires reliable detection of small pattern defects such as bridge, burr, pinch, and contamination. In this study, we propose a two-stage vision-language framework that combines initial defect detection with prediction refinement. In the first stage, Qwen3-VL is fine-tuned with LoRA as a vision-language adapter to predict defect counts, defect categories, and normalized bounding boxes from lithography images. However, direct fine-tuning may still produce common test-time errors, including false positives, missed defects, and incorrect defect types. To address this limitation, the second stage trains a refinement module using first-stage prediction failures and their corrected labels, allowing the model to review and revise initial outputs. By learning from cases where the initial adapter fails, the refinement process improves defect inference beyond single-stage fine-tuning.
Multimodal large language models have demonstrated strong defect recognition capability in industrial anomaly detection. However, in lithography review, merely determining whether an image contains a defect is insufficient for engineering inspection; models must also understand defect morphology, spatial location, and the potential causes supported by visible evidence. To this end, this paper proposes LDU-Bench, a multi-task multimodal benchmark for lithography defect understanding. Constructed from real lithography and integrated-circuit review images, LDU-Bench decomposes the review workflow into four independent tasks: defect triage, morphology recognition, coarse localization, and image-conditioned cause analysis. It systematically evaluates models using task-level metrics, diagnostic readouts, and the Lithography Closure Score (LCS). Experimental results show that although existing MLLMs can perform defect triage relatively reliably, this ability does not stably transfer to downstream review stages. Morphology alignment, effective localization, and evidence-to-cause mapping remain the major bottlenecks. Further diagnostics indicate that this capability break is not a fluctuation of a single metric, but reflects insufficient structured understanding across semantic levels. Overall, LDU-Bench provides a quantifiable and diagnostic unified platform for evaluating the usability, failure points, and capability boundaries of industrial MLLMs in lithography review chains.
We present WaferSAGE, a framework for wafer defect visual question answering using small vision-language models. To address data scarcity in semiconductor manufacturing, we propose a three-stage synthesis pipeline incorporating structured rubric generation for precise evaluation. Starting from limited labeled wafer maps, we employ clustering-based cleaning to filter label noise, then generate comprehensive defect descriptions using vision-language models, which are converted into structured evaluation rubrics criteria. These rubrics guide the synthesis of VQA pairs, ensuring coverage across defect type identification, spatial distribution, morphology, and root cause analysis. Our dual assessment framework aligns rule-based metrics with LLM-Judge scores via Bayesian optimization, enabling reliable automated evaluation. Through curriculum-based reinforcement learning with Group Sequence Policy Optimization (GSPO) and rubric-aligned rewards, our 4B-parameter Qwen3-VL model achieves a 6.493 LLM-Judge score, closely approaching Gemini-3-Flash (7.149) while enabling complete on-premise deployment. We demonstrate that small models with domain-specific training can surpass proprietary large models in specialized industrial visual understanding, offering a viable path for privacy-preserving, cost-effective deployment in semiconductor manufacturing.
Deploying AI-based visual inspection in manufacturing is hard because requirements change often, new defect types appear, and large labeled datasets are rarely available. We propose answer-conditioned chain-of-thought (CoT) distillation for rapidly adapting small vision-language models (VLMs) to new industrial tasks using minimal labeled data. A frontier VLM receives each training image along with its correct label and generates a justified visual explanation. A 3B-parameter model is then fine-tuned on these reasoning-augmented examples via LoRA. By conditioning on correct answers, we ensure all training reasoning is directed toward the correct conclusion, which is critical because frontier models score as low as 24.1% on our hardest task. We validate on four industrial classification tasks spanning three image modalities using only 18 to 30 labeled images per task. Across 4 seeds per task (32 training runs), our method outperforms direct fine-tuning on all 16 seed-task combinations, with mean improvements of +1.7 to +4.4 percentage points. A controlled equal-budget experiment confirms the improvement comes from reasoning quality, not additional training steps. An unconditioned baseline demonstrates that with out answer-conditioning, wrong reasoning degrades performance by 17.8 percentage points. On weld radiograph classification, the fine-tuned 3B model outperforms GPT-4.1 by 10.0pp using just 24 training images.