SePArate: Segmenting Patterns from Defects in Wafer Manufacturing Using Weak Supervision

We present WaferSAGE, a framework for wafer defect visual question answering using small vision-language models. To address data scarcity in semiconductor manufacturing, we propose a three-stage synthesis pipeline incorporating structured rubric generation for precise evaluation. Starting from limited labeled wafer maps, we employ clustering-based cleaning to filter label noise, then generate comprehensive defect descriptions using vision-language models, which are converted into structured evaluation rubrics criteria. These rubrics guide the synthesis of VQA pairs, ensuring coverage across defect type identification, spatial distribution, morphology, and root cause analysis. Our dual assessment framework aligns rule-based metrics with LLM-Judge scores via Bayesian optimization, enabling reliable automated evaluation. Through curriculum-based reinforcement learning with Group Sequence Policy Optimization (GSPO) and rubric-aligned rewards, our 4B-parameter Qwen3-VL model achieves a 6.493 LLM-Judge score, closely approaching Gemini-3-Flash (7.149) while enabling complete on-premise deployment. We demonstrate that small models with domain-specific training can surpass proprietary large models in specialized industrial visual understanding, offering a viable path for privacy-preserving, cost-effective deployment in semiconductor manufacturing.

Latent defect screening is challenged by extremely low failure rates, high-dimensional test data, and absence of labeled anomalies. We propose the first unsupervised anomaly detection framework incorporating a Diffusion Transformer. Raw test measurements are first compressed by an autoencoder, then reshaped into a structured token sequence enriched with sinusoidal and per-device wafer-position embeddings. Anomaly scores are derived from the noise-prediction error over mid-range diffusion timesteps, enabling fast wafer-scale screening without any labeled defects or manual feature engineering. Our approach achieves state-of-the-art performance on industrial 16nm IC test data under extreme class imbalance, offering interpretable failure localization through latent-space reconstruction residuals.

Super-resolution can make inspection images appear sharper without preserving the evidence needed to detect a defect. We study this failure mode with a benchmark that separates reconstruction from detection and evaluates both at a predeclared low false-positive rate. Ten end-to-end repetitions combine independently generated line/space and contact-hole images with model training, calibration, clean controls, weak defects, and a held-out defect morphology. Every reconstruction is scored by the same local residual detector, while direct and jointly trained detectors form a separate comparison track. Reconstruction fidelity and inspection utility diverge: the two learned reconstruction models attain the highest structural similarity yet detect fewer defect pixels than bicubic interpolation in every paired repetition. A direct DeepLabV3 detector reaches $0.1984\pm0.0385$ recall at $0.000174\pm0.000084$ false-positive rate and satisfies the held-out feasibility criterion in all ten repetitions. An illustrative joint model, DPU-WaferSR, passes independent clean calibration but exceeds the held-out limit in all ten repetitions, demonstrating that calibration success does not guarantee transfer. Weak-defect recall remains near zero for every feasible method. Applying the unchanged policies to 4,591 public Carinthia-S masks further reveals large method-dependent shifts on real SEM texture. These results support a simple conclusion: super-resolution for inspection should be judged by preserved task evidence and operating-point transfer, not reconstruction quality alone.