A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling

Thermal-aware optimization of multi-die 3D integrated circuits evaluates many designs, each a costly heat-equation solve. Operator-learning surrogates replace this solve with a fast forward pass, ideally trained from physics alone, without labeled data. DeepOHeat-v1 made such surrogates fast and trustworthy, but only on low-contrast geometries. High-contrast multi-die stacks break it in two ways: discontinuous conductivities make the continuous physics loss ill-defined at material interfaces, and ill-conditioning ($κ_2(A_h) \approx 6 \times 10^4$) puts the discretized strong-form loss beyond first-order optimization. We propose DeepOHeat-v2 to overcome both. First, we train on a discretized physics loss that handles the discontinuities natively; its energy form reduces the prediction-space loss-Hessian conditioning from $κ^2$ to $κ$, and a matrix-preconditioned optimizer cuts the mean peak temperature error from over 30 K to 0.55 K. Second, because optimization leaves the training distribution, we propose a self-improving framework: a hotspot trust gate sends flagged placements to a reference solver, and the surrogate incrementally retrains on the refined solutions, keeping an update only when it improves held-out validation error. On a multi-die benchmark, the surrogate-true peak gap on the returned design falls from 1.12 K to 0.11 K, matching a solve-at-every-step optimizer while running $56\times$ faster.

Thermal optimization of 2D CFET inverters requires testing structural proposals against their electrical costs. We examine these research tasks using an AI agent workflow within a supplied electrothermal model. At 12 nm, Astra selects a redistributed source-interconnect geometry, while a coordinating agent proposes a substrate-directed heat-removal path. The combined design reduces peak temperature rise by 1.67 K at fixed metal volume and 20 μW. A subsequent metal-resistance sensitivity gives about 0.6-K inverter cooling alongside a 2% nFET on-current loss. Effective contact-length scaling further shows that lower temperature can accompany higher thermal resistance when current falls. Reproduction identifies agreeing implementations and retains a 104.95-K failure for diagnosis. These results show that an AI scientist workflow can propose thermal structures, test them under common constraints, and quantify their electrical cost.

Transformer-based surrogate models are increasingly used to replace expensive first-principles simulation in engineering design. But conventional transformer architectures are often over parameterized for the small, low-dimensional datasets typical of engineering design spaces, where large simulation data is expensive to generate. Under these conditions, excess parameter capacity leads to overfitting rather than improved accuracy, while also incurring unnecessary memory and compute overhead. This motivates a shift towards architectures that focus on additional compute rather than additional learnable parameters. This paper presents a hardware-aware evaluation of three recursive transformer paradigms for surrogate thermo-mechanical analysis of advanced packages: a)Tiny Recursive Model, b) our proposed Depth Recursive transformer, c) and a simple recursive transformer. We systematically compare their predictive performance (Recall, Mean Reciprocal Rank), parameter count, computational complexity (FLOPs), providing practical design guidelines for selecting recursive transformer architectures under resource-constrained scenarios. We validate this principle on two low-dimensional engineering prediction tasks: 1) thermo-mechanical reliability analysis of advanced semiconductor packages, where stress and warpage from thermal cycling must be evaluated repeatedly across a design-of-experiments sweep under costly finite element analysis (FEA). 2) Laplace PDE iterative numerical solver for capacitance field. Overall, recursive weight-sharing transformers provide an effective and generalizable trade-off between prediction accuracy, parameter efficiency, and computational cost for small data engineering surrogate modeling.