Morphology-Aware Ambiguity Learning for Wafer Defect Decision Support

Spatial defect signatures on wafer bin maps (WBMs) trace yield loss to specific process faults, yet supervised classifiers recognize only the defect types seen during training, and one-class detectors built on a single mechanism tend to capture either local structural deviations or global distributional violations, but rarely both. This work proposes a hybrid one-class framework that couples a patch-based student-teacher detector (EfficientAD) with a denoising diffusion probabilistic model (DDPM) used for partial-diffusion reconstruction, and fuses their percentile-calibrated scores through a fixed convex combination. Trained on only 700 normal wafers from the WM-38K mixed-type dataset and evaluated on 18,658 held-out wafers, the fused detector reached an AUROC of 0.9985 and reduced misclassifications from 852 (DDPM) and 1,412 (EfficientAD) to 618, with all pairwise differences significant at p < 0.001. Beyond aggregate accuracy, the analysis shows that the gain arises from weakly overlapping errors between the two modules, yet fixed-weight fusion recovers only 40-70% of the correction available to an oracle selector. Under the benchmark's inverted class balance, average precision and F1 saturate, while the Matthews correlation coefficient and negative predictive value expose unreliable normal predictions. Pixel-level maps further show that strong image-level separability does not imply spatial localization, and the diffusion module succeeds as a local density prior rather than through global geometric reasoning. These findings motivate sample-adaptive fusion and imbalance-aware evaluation of hybrid wafer anomaly detectors.

In semiconductor manufacturing, defect analysis is essential, but manual inspection cannot scale. However, existing automated inspection methods remain insufficient for root-cause analysis and process optimization. To this end, we present SePArate, a weakly supervised wafer defect segmentation method. SePArate enables pixel-level separation of patterns by leveraging only image-level annotations. It consists of a three-phase training: encoder pretraining, knowledge transfer to learn spatial cues, and training on synthetic mixed-defect data for accurate segmentation. Experiments demonstrate that SePArate outperforms the baselines.

Conventional wafer defect analysis relies on offline, closed-world classifiers that fail to detect novel, unseen defect signatures emerging during continuous semiconductor manufacturing. To address this, we propose WaferHDC, an online open-world wafer defect discovery framework based on hyperdimensional computing (HDC). The memory-centric architecture of WaferHDC enables rapid anomaly detection and grouping of recurring failures into compact hypervector representations. This allows the memory space to dynamically scale with new defect modes without retraining a static classifier or archiving entire raw wafer history. WaferHDC first models normal spatial distributions, then dynamically groups recurring failures into persistent defect memory without labels or predefined class counts. It outperforms the strongest online baseline by 13.3 p.p. in adjusted Rand index and 10.5 p.p. in normalized mutual information on the industry-standard WM-811K dataset. These results demonstrate the effectiveness of WaferHDC for continuous and open-world wafer defect analysis.