Zero-Shot Multi-Class Wafer Map Classification with Rule-Ordered Prompts for Large Multimodal Models
Organizations: Fudan University Shanghai, China
Abstract
Wafer-map defect classification often requires labeled data and retraining when production conditions change. We present a training-free six-class framework that combines connected-component highlighting with morphology-, location-, and exclusion-aware prompts for a frozen large multimodal model. On Mixed-WM38 (6,866 maps), multi-region prompting achieves 92.9% macro and 93.8% overall accuracy. On WM811K (9,000 maps), it achieves 79.1% and 81.3%, respectively. Eight alternative rule orders achieve 90.1-91.9% overall accuracy, compared with 93.8% for the selected order.
Figures & tables
| Class | Positive morphology | Spatial anchor | Exclusion condition |
|---|---|---|---|
| Center | Dense, compact, predominantly solid cluster | Centered or near wafer center | Exclude hollow, annular, rim-aligned, elongated, and wafer-wide patterns. |
| Donut | Ring, hollow center, arc, crescent, C-shape, spiral, or partial annulus | Around or partly surrounding wafer center | Exclude solid central clusters without a clear opening. |
| Edge | Continuous or fragmented arc, peripheral band, rim-following segment, or edge ring | Attached to and aligned with the circular boundary | Boundary contact alone is insufficient; Exclude inward compact clusters and non-circumferential elongated traces. |
| Local | Thick, compact, solid clump or polygonal aggregation | Non-central interior, or boundary-near but extending inward | Exclude rim-following arcs, wafer-wide patterns, central clusters, and elongated traces. |
| Random | Large block-like regions with broad interior coverage and little continuous gray area | Across much of the interior without rim confinement | Exclude local clusters, annular structures, elongated traces, and rim-aligned arcs or rings. |
| Scratch | Long, narrow, line-like, stripe-like, diagonal, or aligned broken chain | Any wafer location | Exclude compact blobs with short tails and arcs whose principal direction follows the rim. |
| Method | C | D | E | L | R | S | Macro | Overall |
|---|---|---|---|---|---|---|---|---|
| Raw | 9.5 | 97.1 | 2.8 | 11.7 | 97.9 | 46.8 | 44.6 | 37.5 |
| Single | 99.6 | 97.3 | 95.6 | 98.0 | 70.1 | 94.0 | 92.4 | 93.3 |
| Multi | 97.6 | 98.7 | 96.8 | 92.1 | 78.5 | 93.9 | 92.9 | 93.8 |
| Names-only | 69.7 | 39.4 | 90.9 | 64.2 | 24.7 | 60.5 | 58.2 | 63.6 |
| Variant | C | D | E | L | R | S | Macro | Overall |
|---|---|---|---|---|---|---|---|---|
| Default | 97.6 | 98.7 | 96.8 | 92.1 | 78.5 | 93.9 | 92.9 | 93.8 |
| Center-first | 92.1 | 96.3 | 94.0 | 93.0 | 76.5 | 91.1 | 90.5 | 91.3 |
| Edge-before-Scratch | 94.5 | 97.7 | 92.3 | 93.7 | 77.5 | 87.0 | 90.4 | 91.0 |
| Local-before-Edge | 96.1 | 97.5 | 89.0 | 94.0 | 71.7 | 91.0 | 89.9 | 90.1 |
| Local-before-Scratch | 95.5 | 98.1 | 92.0 | 96.0 | 80.1 | 80.5 | 90.4 | 90.8 |
| Random-before-Edge | 94.0 | 96.9 | 91.5 | 95.5 | 80.3 | 92.3 | 91.8 | 91.9 |
| Method | C | D | E | L | R | S | Macro | Overall |
|---|---|---|---|---|---|---|---|---|
| Raw | 52.4 | 72.1 | 26.5 | 31.0 | 99.6 | 70.8 | 58.7 | 43.7 |
| Single | 94.7 | 61.6 | 79.1 | 78.4 | 69.8 | 76.4 | 76.7 | 80.1 |
| Multi | 91.3 | 73.1 | 81.0 | 76.4 | 74.8 | 80.9 | 79.1 | 81.3 |
Semiconductor Manufacturing
Semiconductor manufacturing uses process engineering, metrology, and automation to make chips reliably, improve yield, and meet tight device requirements.
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