Formal Foundations for Known Good Reliable Die Screening in Chiplet-Based AI Systems-on-Chip

Embodied AI systems are increasingly deployed in open-world environments, yet ensuring their reliability remains a fundamental challenge. Drawing on discussions from the AAAI'26 Bridge Program on "Making Embodied AI Reliable with Testing and Formal Verification", this article argues that reliability in embodied AI is inherently a lifecycle assurance problem arising from uncertainty, human interaction, and emergent behaviors across tightly coupled system components. We identify three complementary directions toward reliable embodied AI: (1) trustworthy scenario-based testing supported by validated specifications and meaningful coverage metrics, (2) compositional verification enabled by structured symbolic representations of system behavior and environmental context, and (3) runtime assurance mechanisms capable of adapting to uncertainty and distribution shifts during deployment. Rather than treating these approaches independently, we advocate integrated assurance workflows that connect testing, verification, and runtime adaptation through shared neuro-symbolic representations and continuous feedback across the system lifecycle. Such integration provides a foundation for building trustworthy embodied AI systems that can operate safely and reliably in complex real-world environments.

Reliability qualification of advanced semiconductor devices requires sequential stress decisions that balance characterization objectives against multiple competing failure mechanisms. Current practice relies on static test plans derived from population-level acceleration models, which cannot adapt to per-unit variability or real-time degradation observations. This paper presents a closed-loop adaptive test planning framework that formulates reliability qualification as a partially observable sequential decision problem and solves it using Monte Carlo tree search for seed-action simulators (MCTS-SA) coupled with extended Kalman filter (EKF) belief-state estimation. The framework models stochastic, per-device variability in bias temperature instability (BTI), electromigration (EM), and time-dependent dielectric breakdown (TDDB), and treats stress selection as a constrained sequential optimization, i.e., to maximize the probability of successful degradation characterization while respecting catastrophic failure constraints. Under the experimental assumptions used here (discrete stress actions, proxy damage observability, and cumulative degradation without recovery), we believe this to be a novel application of tree-search-based adaptive test planning to multi-mechanism reliability qualification. Across 5,000 planning iterations, the characterization yield (CY) improves from 20% in the first 500 iterations to over 54% in the final 500, with 39% cumulative success, while the best successful test sequence terminates with EM and TDDB damage fractions DEM=0.564 and DTDDB=0.537, well within safety margins. These results demonstrate that sequential Bayesian planning can synthesize damage-aware test policies that significantly outperform non-adaptive strategies for reliability qualification under competing failure modes.

Reliable inference requires that artificial intelligence (AI) models provide trustworthy uncertainty estimates, not merely accurate predictions. Recent advances in Bayesian learning have made significant progress toward this goal, and growing concerns about computational overhead have jointly shifted the design criterion from reliability alone to the co-design of reliability and efficiency, i.e., reducing computational overhead while preserving trustworthy uncertainty quantification. This thesis develops a unified framework from two perspectives to address the central question: can we efficiently perform reliable inference?