eess.SYOct 23, 2026

Modeling Liquid-Cooled Data Centers in EnergyPlus

Authors: Yun-Dam Ko, Dipashreya A. Sur, Cade Napier, Carlos D. Díaz-Marín, Rishee K. Jain

Organizations: Stanford University, Stanford, California, USA

Abstract

As AI workloads accelerate data center transition toward high-density racks with direct-to-chip (DTC) liquid cooling, existing simulation tools remain limited in evaluating whole-building and multi-year efficiency. To bridge this gap, we develop a native EnergyPlus object, ElectricEquipment:ITE:LiquidCooled, that models DTC liquid cooling for chilled-water and warm-water architectures as plant-loop components. It couples facility-water loops, rack-side secondary loops, coolant distribution units, and chip-junction temperatures within a single solver. Validation against an independent Modelica implementation across 21 operating conditions, including two full-year runs compared at one-minute resolution, yields loop-temperature RMSE at or below 0.021 K, well within the 0.1 K acceptance threshold. Our case study demonstrates that warm-water liquid cooling reduces annual PUE from 1.43 to 1.25, eliminates on-site water use, and cuts total facility energy by 37.9% relative to an air-cooled baseline. By embedding liquid-cooling logic into EnergyPlus, our work provides whole-building, long-term energy modeling for high-density AI infrastructure within an open-source framework.

Figures & tables

Explore similar work

CardsList
  1. AI-driven Thermal-aware Data Center Capacity Planning

    Oct 1, 2026Yixing Li, Mark Fenton, Matthew Kaufeler +3Surrogate Modeling

  2. A Physics-Aware Framework for Short-Term GPU Power Forecasting of AI Data Centers

    Apr 14, 2026Mohammad AlShaikh Saleh, Sanjay Chawla, Sertac Bayhan +2Time Series ForecastingElectricity Load Forecasting