cond-mat.mtrl-sciApr 1, 2026

AI-assisted Human-in-the-Loop Web Platform for Structural Characterization in Hard drive design

Authors: Utkarsh Pratiush, Huaixun Huyan, Maryam Zahiri Azar, Esmeralda Yitamben, Allen Bourez, Sergei V Kalinin, Vasfi Burak Ozdol

Organizations: Department of Materials Science and Engineering, University of Tennessee, Knoxville, TN 37996, USA · Western Digital corporation, 5601 Great Oaks Parkway, San Jose, CA 95119, USA

Abstract

Scanning transmission electron microscopy (STEM) has become a cornerstone instrument for semiconductor materials metrology, enabling nanoscale analysis of complex multilayer structures that define device performance. Developing effective metrology workflows for such systems requires balancing automation with flexibility; rigid pipelines are brittle to sample variability, while purely manual approaches are slow and subjective. Here, we present a tunable human-AI-assisted workflow framework that enables modular and adaptive analysis of STEM images for device characterization. As an illustrative example, we demonstrate a workflow for automated layer thickness and interface roughness quantification in multilayer thin films. The system integrates gradient-based peak detection with interactive correction modules, allowing human input at the design stage while maintaining fully automated execution across samples. Implemented as a web-based interface, it processes TEM/EMD files directly, applies noise reduction and interface tracking algorithms, and outputs statistical roughness and thickness metrics with nanometer precision. This architecture exemplifies a general approach toward adaptive, reusable metrology workflows - bridging human insight and machine precision for scalable, standardized analysis in semiconductor manufacturing. The code is made available at https://github.com/utkarshp1161/thickness-mapping-webapp

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