LithoDreamer: A Physics-Informed World Model for Multi-Stage Computational Lithography

In semiconductor manufacturing, lithography projects circuit layouts onto silicon wafers through an optical mask. As circuit features shrink below the wavelength of light, optical diffraction causes the printed patterns to deviate from their intended layouts. Inverse Lithography Technology (ILT) addresses this challenge by generating optimized masks that enhance the fidelity of pattern transfer onto wafers. While ILT resembles an image synthesis task, its reliance on explicit physical metrics for mask evaluation limits the applicability of existing generative models. We introduce LithoGRPO, an ILT framework that integrates the flow-matching paradigm with GRPO-based reinforcement learning (RL) fine-tuning, enabling efficient exploration of diverse masks for a given target layout. Unlike purely generative or optimization-based approaches, RL in LithoGRPO exploits the explicitly defined, physics-based reward function of ILT, enabling optimization under complex, process-aware constraints. To the best of our knowledge, this is the first framework that unifies flow matching and RL for mask optimization. To improve RL sampling efficiency, we propose a fast shot-counting algorithm for manufacturability evaluation, achieving over 130x speedup while preserving the mask ranking of the traditional shot-count metric. Extensive experiments demonstrate that LithoGRPO achieves state-of-the-art performance over both optimization-based and learning-based methods, while maintaining efficient mask generation.

Generative models are increasingly used to propose designs, data, and control actions for physical systems, yet many such systems are governed by hard physical constraints rather than by perceptual plausibility. Semiconductor manufacturing provides a demanding test case: generated masks, layouts, synthetic defect data, and process recipes must obey lithography, transport, reaction, and device-physics constraints, because physically invalid samples are not merely low quality but unusable. This Perspective argues that semiconductor manufacturing exposes a broader computational-science challenge, namely that generative AI for constrained physical domains must be physics-informed by construction, not corrected only through post-hoc filtering. We survey the emerging architectural toolkit, including physics-informed diffusion, PDE-constrained variational models, neural-operator priors, and conservation-law-respecting generative networks, and show how it connects to differentiable lithography, TCAD, process simulation, and autonomous experimentation. We identify four integration patterns between generative models and physics-based simulators, and we propose a research agenda centered on physics-fidelity benchmarks, differentiable simulator infrastructure, and multimodal foundation models for physical design and manufacturing. The central claim is analytical rather than rhetorical: where physical validity is the binding criterion of success, architectures that enforce it by construction should be expected to outperform those that filter for it after the fact, and the fab is the setting where this distinction is sharpest.

Semiconductor lithography inspection requires reliable detection of small pattern defects such as bridge, burr, pinch, and contamination. In this study, we propose a two-stage vision-language framework that combines initial defect detection with prediction refinement. In the first stage, Qwen3-VL is fine-tuned with LoRA as a vision-language adapter to predict defect counts, defect categories, and normalized bounding boxes from lithography images. However, direct fine-tuning may still produce common test-time errors, including false positives, missed defects, and incorrect defect types. To address this limitation, the second stage trains a refinement module using first-stage prediction failures and their corrected labels, allowing the model to review and revise initial outputs. By learning from cases where the initial adapter fails, the refinement process improves defect inference beyond single-stage fine-tuning.